ECEN-4324 (3) Fundamentals of Microsystem Packaging

Introduction to the fundamentals of microsystems packaging. This is a seminar style course which surveys topics in microsystem packaging such as: electrical package design, design for reliability, thermal management, multichip packaging, IC Assembly, sealing and encapsulation, and board assembly. Same as ECEN 5324. Requisites: Requires prerequisite course or corequisite course of ECEN 3410 (minimum grade C-). Restricted to College of Engineering majors only.