Introduction to the fundamentals of microsystems packaging. This is a seminar style course which surveys topics in microsystem packaging such as: electrical package design, design for reliability, thermal management, multichip packaging, IC Assembly, sealing and encapsulation, and board assembly. Coreq., ECEN 3410 or instructor consent. Same as ECEN 5324. Prerequisites: Restricted to students with 87-180 credits (Senior, Fifth Year Senior) College of Engineering majors only.