To provide basic knowledge of the technologies and processes required for the packaging and manufacturing of electronic products. Topics covered include wafer fabrication, different levels of packaging, thermal management, life cycle engineering, printed wiring board assembly processes, and process control. Restricted to College of Engineering and Applied Science Graduate Students or BS/MS Mechanical Engineering Concurrent Degree students. Prerequisites: Restricted to College of Engineering and Applied Science Graduate Students or BS/MS Mechanical Engineering or Concurrent Degree students.